The integration of TeraSpike microprobes into existing optoelectronic set-ups is simplified through the use of standardized optical mounting components and the following sub-systems featuring further basic funtions.

The core sub-system D-B1-TR is a mini-board module with pre-aligned opto-mechanical components for the system integration of the TeraSpike transceiver microprobe series (TR).

Functions:

• Microprobe fixation
• Manual beam-to-microprobe focusing (for two beams)
• Manual beam-to-microprobe alignment (for two beams)
• Manual microprobe height variation

The core sub-system D-B1 is a mini-board module with pre-aligned opto-mechanical components for the system integration of TeraSpike microprobes

Functions:

• Microprobe fixation
• Manual beam-to-microprobe focusing
• Manual beam-to-microprobe alignment
• Manual microprobe height variation

Sub-system D-B2 is a vertical breadboard platform holding the core module D-B1 as well as further beam guiding components. It is offering enough space for additional components such as a CCD camera for probe-tip monitoring or a distance sensor for the sampling of profiled or tilted sample surfaces.

Content:

• Motherboard including sub-system D-B1 in customized height
• Assembly brackets
• 2 alignment apertures
• 2 tilt mirrors
• Extendable with further components such as CCD camera and distance sensor

Optional extension:

• Sub-D-B2-CAM: Integrated CCD microscope camera system with variable illumination for monitoring of probe-tip to sample surface approximation and sample positioning 

Exemplary CCD camera image of a TeraSpike microprobe tip above sample microstructure.

The TeraSpike Defender is an optional housing protecting the sensitive tip of the probe against accidential mechanical impact. The exposure of the tip can be manually adjusted from -1mm to +1mm. In the negative exposure range a direct contact of the probe-tip to a flat surface is prevented by the TeraSpike Defender housing. Optical excitation as well as visual monitoring of the tip region is not impaired by the protective structure thanks to vertically placed openings. The TeraSpike Defender can be applied to any existing or new TeraSpike probe.

The new SHG-Unit from Protemics is an easy to operate optical module and very efficient solution to convert IR light from cost-efficient femtosecond fiber-lasers into NIR light for the high-efficiency excitation of our LT-GaAs-based TeraSpike microprobes and TeraBlast emitters.

Key benefits:

• Recommended for TeraSpike microprobe operation with IR femtosecond lasers
• High power conversion efficiency SHG module
• Passive and robust design
• Short warm-up time(10-15 min)
• Can be configured for free-space (-FS) or fiber-coupled input beams (-FC)
• Easy to use and integrate

Schematic:

Technical specifications:

For more information please refer to our product brochure (2 MB PDF-file) or contact us.

The TeraSpike Phantom is a dummy device for the replacement of a microprobe during construction work and system development. The use of the TeraSpike Phantom - as also included in the starter kit - is recommended to avoid the risk of an uncontrolled mechanical impact in critical working situations.

The following accessory is offered.

TS cable

SMP to SMA connection cable plus SMA-to-BNC adapter (also included in the starter kit).

Target design model: P-TTT-2-1200

The test target P-TTT-2-1200 has been specially developed for the characterization of Terahertz imaging systems. Featuring structures and areas from 2 µm up to 8 mm of lateral size it is suited for standard diffraction-limited systems as well as near-field imaging systems with sub-wavelength resolution.

The test target is based on high-resistivity silicon and contains conductor areas with three different transmission strengths beside uncoated substrate areas with maximum transmission. The featured structures include classic resolution test structures such as orthogonal pairs of three stripe structures, a Siemens star and concentric rings. These typical structures are accompanied by further structures specially useful for near-field imaging purposes such as metamaterial structures generating local field confinement. Additionally, areas helpful as references for sheet resistance imaging and wafer scanning applications are also listed.

Specifications: