One near-field platform, four measurement domains — from wafer characterization to buried-defect screening.
Map sheet resistance and carrier mobility at micron-scale resolution — non-destructive, contactless probing of displays, flexible electronics and graphene.
Sheet-resistance imaging →Explore the near-field of emitters, waveguides, sensor surfaces and plasmonic structures with high-sensitivity, low-invasiveness microprobes.
Metamaterials & plasmonics →High-resolution time-domain reflectometry for fault isolation, package-level inspection and on-chip device characterization — sub-picosecond, contactless.
Chip & package inspection →Inspect plastic laser welds, fiber-reinforced polymers and organic layers — detect micron-scale defects buried in visually opaque materials.
Phenomena that take place in picoseconds, visualized in the near field with a TeraCube M2 imaging system. A new way to see real-world ultrafast electrodynamics.
We develop and manufacture components, sub-systems and full system solutions for high-resolution THz imaging.
THz researcher and inventor/co-inventor of the company's core technology components.
Physicist, THz researcher, system, software and application developer.
Physicist; develops data-analysis software and optoelectronic systems.
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